The structure with the little mechanical transformation against the workload of grinding is realized by placing the processing position on the center position of the slide guides placed in a triangle form and the infeed shaft on the processing position.
Due to the high-rigidity, it enables the processing with shorter amount of time while reducing the grinding damage.
Due to the high-rigidity, it enables the processing of the appropriate self-sharpening. 　It prolongs the life of the grindstone.
It is equipped with the in-process gauge that is batch processing-compliant, and performs the processing while measuring the wafer thickness in the batch processing.
It detects the clogging of the grindstone and performs the dressing as necessary.