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TRUMPF TRUMARK STATION 1000

Marking with the TruMark Station 1000 is fast, simple and flexible.

마킹 영역(X):9.843 in
마킹 영역(Y):11.81 in
1 사진
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TRUMPF TRUMARK STATION 5000

The extremely compact TruMark Station 5000 is available with a wide variety of options for perfect configuration to your tasks.

마킹 영역(X):26.77 in
마킹 영역(Y):27.56 in
1 사진
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TRUMPF TRUMARK STATION 7000

With its large interior dimensions, the TruMark Station 7000 provides plenty of space for nearly any application. It doesn't matter whether you're marking individual large, heavy parts or a large v...

마킹 영역(X):19.69 in
마킹 영역(Y):39.37 in
1 사진
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TYKMA EMS400

EMS400 features an automated 600mm x 600mm XY stage, ideal for marking trays of parts or large components in multiple locations. A front vertical pneumatically actuated door maximizes operator ergo...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:100.0 w
1 사진
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TYKMA FIBER

Our OEM, integration fiber laser engraver. Fiber lasers offer the highest reliability in the industry and this MOPA based system is ideal for high speed marking and a variety of applications.

마킹 영역(X):3.937 in
마킹 영역(Y):3.937 in
와트:50.0 w
1 사진
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TYKMA MINILASE

Our Easy Mode™ system provides maximum efficiency to your marking operation. Simply load the part, press start and the entire marking process is automated. A three-sided automatic vertical door pro...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:20.0 w
1 사진
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TYKMA MINILASE E

The MLMe fiber laser system is heavy on capability, but lite on investment. The manual front door is lightweight and ergonomic thanks to a spring loaded retraction system. A fold-out, side panel to...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:10.0 w
1 사진
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TYKMA MINILASE KEON

Minilase Keon™ takes laser marking innovation to the next level. A revolutionary, patent-pending design provides users the flexibility to mark both small parts and large parts. A four-sided collap...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:30.0 w
1 사진
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TYKMA MINILASE MANUAL

The MLM fiber laser system packs a powerful punch and gives users maximum application flexibility. The manual front door is lightweight and ergonomic thanks to a spring loaded retraction system. A ...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:20.0 w
1 사진
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TYKMA MINILASE XL

Minilase™ XL marks all metals, most plastics, carbide, anodized aluminum, painted/coated materials and more. Powerful MOPA fiber laser technology enhances the marking capabilities over basic q-swit...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:50.0 w
1 사진
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TYKMA SCORPION

Scorpion is equipped with a variety of features that are ideal for integrators looking for a powerful marking laser for their process. Standalone capability allows for onboard storage of the laser ...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:100.0 w
1 사진
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TYKMA VEREO SMART

Vereo Smart is the ultimate tool for manufacturers and integrators requiring a laser marking system for automated lines, assembly cells and more. A maintenance free MOPA fiber laser source up to 50...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:50.0 w
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TYKMA ZETALASE

An expansive work envelope provides capability for marking a wide array of parts, large or small, light or heavy. In addition to the front sliding operator door, the side access door provides opera...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:50.0 w
1 사진
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TYKMA ZETALASE XL

An expansive work area and choice of lenses makes Zetalase™ XL our most flexible system yet. The new Zetalase™ XL features the most expansive work area of our entire product range. Available in mu...

마킹 영역(X):3.93 in
마킹 영역(Y):3.93 in
와트:50.0 w
1 사진
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TYKMA ZETALASE XLT

Zetalase XLT features a continuous marking field up to 24” x 24” (610mm x 610mm) while maintaining a small beam diameter with high energy output. This technology excels over traditional XY stage sy...

마킹 영역(X):24.0 in
마킹 영역(Y):24.0 in
와트:70.0 w
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UNIVERSAL LASER ILS-12.75

마킹 영역(X):24.0 in
마킹 영역(Y):48.0 in
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UNIVERSAL LASER ILS-9.75

마킹 영역(X):24.0 in
마킹 영역(Y):36.0 in
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UNIVERSAL LASER ILS12.150D

The ILS12.150D is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The dual laser platform supports a power ra...

마킹 영역(X):48.0 in
마킹 영역(Y):24.0 in
와트:150.0 w
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UNIVERSAL LASER ILS12.75

The ILS12.75 is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The single laser platform supports either one...

마킹 영역(X):48.0 in
마킹 영역(Y):24.0 in
와트:75.0 w
4 사진
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UNIVERSAL LASER ILS9.150D

The ILS9.150D is a free-standing platform with a materials processing envelope of 36” x 24” x 12” or 10,368 in³ (914 x 610 x 305 mm or 169,901 cm³). The dual laser platform supports a power range o...

마킹 영역(X):36.0 in
마킹 영역(Y):24.0 in
와트:150.0 w
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UNIVERSAL LASER ILS9.75

he ILS9.75 is a free-standing platform with a materials processing envelope of 36” x 24” x 12” or 10,368 in³ (914 x 610 x 305 mm or 169,901 cm³). The single laser platform supports either one 10.6µ...

마킹 영역(X):36.0 in
마킹 영역(Y):24.0 in
와트:75.0 w
5 사진
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UNIVERSAL LASER M-300

마킹 영역(X):12.0 in
마킹 영역(Y):24.0 in

UNIVERSAL LASER PLS-4.75

마킹 영역(X):18.0 in
마킹 영역(Y):24.0 in
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UNIVERSAL LASER PLS-6.150D

The PLS6.150D is a free-standing platform with a materials processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³) that supports dual lasers. As a dual laser platfor...

마킹 영역(X):18.0 in
마킹 영역(Y):32.0 in
5 사진
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UNIVERSAL LASER PLS-6.75

The PLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports either one 10.6µm...

마킹 영역(X):18.0 in
마킹 영역(Y):32.0 in
5 사진
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UNIVERSAL LASER PLS4.75

The PLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 8.5" or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports either one 10.6µ...

마킹 영역(X):24.0 in
마킹 영역(Y):18.0 in
와트:75.0 w
4 사진
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UNIVERSAL LASER PLS6.150D

The PLS6.150D is a free-standing platform with a materials processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³) that supports dual lasers. As a dual laser platfor...

마킹 영역(X):32.0 in
마킹 영역(Y):18.0 in
와트:150.0 w
1 사진
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UNIVERSAL LASER PLS6.75

The PLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports either one 10.6µm...

마킹 영역(X):32.0 in
마킹 영역(Y):18.0 in
와트:75.0 w
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UNIVERSAL LASER PLS6MW

The PLS6MW (Multi-Wavelength) is a free-standing platform uses multiple laser wavelengths to process the broadest possible spectrum of materials and supports either CO2 or fiber lasers. The PLS6MW ...

마킹 영역(X):18.0 in
마킹 영역(Y):32.0 in
4 사진
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UNIVERSAL LASER ULTRA R5000

The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academ...

마킹 영역(X):32.0 in
마킹 영역(Y):24.0 in
와트:150.0 w
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UNIVERSAL LASER ULTRA X6000

The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research ...

마킹 영역(X):36.0 in
마킹 영역(Y):24.0 in
와트:300.0 w
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UNIVERSAL LASER VLS-2.30

마킹 영역(X):12.0 in
마킹 영역(Y):16.0 in
와트:30.0 w
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UNIVERSAL LASER VLS-3.50

마킹 영역(X):12.0 in
마킹 영역(Y):24.0 in
와트:50.0 w
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UNIVERSAL LASER VLS-3.60

마킹 영역(X):12.0 in
마킹 영역(Y):24.0 in
와트:60.0 w
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UNIVERSAL LASER VLS-4.60

마킹 영역(X):18.0 in
마킹 영역(Y):24.0 in
와트:60.0 w
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UNIVERSAL LASER VLS-6.60

마킹 영역(X):18.0 in
마킹 영역(Y):32.0 in
와트:60.0 w
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UNIVERSAL LASER VLS2.30DT

The VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16" x 12" x 4" or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped ...

마킹 영역(X):16.0 in
마킹 영역(Y):12.0 in
와트:30.0 w
1 사진
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UNIVERSAL LASER VLS3.60DT

The VLS3.60DT is a compact and economical entry level platform that offers a material processing envelope of 24" x 12" x 4" or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.60DT can be equ...

마킹 영역(X):24.0 in
마킹 영역(Y):12.0 in
와트:60.0 w
1 사진
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UNIVERSAL LASER VLS3.75

The VLS3.75 is a free-standing platform with a materials processing envelope of 24" x 12" x 8.5" or 2,448 in³ (610 x 305 x 216 mm or 40,187 cm³). The single laser platform supports a 10.6µm CO2 las...

마킹 영역(X):24.0 in
마킹 영역(Y):12.0 in
와트:75.0 w
1 사진
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UNIVERSAL LASER VLS4.75

The VLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 8.5" or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports a 10.6µm CO2 las...

마킹 영역(X):24.0 in
마킹 영역(Y):18.0 in
와트:75.0 w
1 사진
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UNIVERSAL LASER VLS6.75

The VLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO2 lase...

마킹 영역(X):32.0 in
마킹 영역(Y):18.0 in
와트:75.0 w
1 사진
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US LASER 4024

마킹 영역(X):24.0 in
마킹 영역(Y):40.0 in
와트:30.0 w
1 사진
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VISION LASERTECHNIK LMI

마킹 영역(X):4.331 in
마킹 영역(Y):4.331 in
와트:20.0 w
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VYTEK CO2 OEM

The CO2 OEM series are the most advanced and reliable industrial grade sealed CO2 laser marking and laser cutting systems available on the market today. With a host of configurations and options, t...

마킹 영역(X):16.54 in
마킹 영역(Y):16.54 in
1 사진
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VYTEK CO2CAB 11X11

The CO2Cab Cutting System Series is a fully integrated fully enclosed 10.6nm CO2 galvo system unlike any other system on the market. The CO2Cab is both a marking and cutting solution for many organ...

마킹 영역(X):11.42 in
마킹 영역(Y):11.42 in
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VYTEK CO2CAB 2X2

The CO2Cab Cutting System Series is a fully integrated fully enclosed 10.6nm CO2 galvo system unlike any other system on the market. The CO2Cab is both a marking and cutting solution for many organ...

마킹 영역(X):2.32 in
마킹 영역(Y):2.32 in
와트:450.0 w
1 사진
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VYTEK CO2CAB 4X4

The CO2Cab Cutting System Series is a fully integrated fully enclosed 10.6nm CO2 galvo system unlike any other system on the market. The CO2Cab is both a marking and cutting solution for many organ...

마킹 영역(X):4.3 in
마킹 영역(Y):4.3 in
1 사진
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VYTEK CO2CAB 6X6

The CO2Cab Cutting System Series is a fully integrated fully enclosed 10.6nm CO2 galvo system unlike any other system on the market. The CO2Cab is both a marking and cutting solution for many organ...

마킹 영역(X):6.89 in
마킹 영역(Y):6.89 in
1 사진
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VYTEK CO2CAB 9X9

The CO2Cab Cutting System Series is a fully integrated fully enclosed 10.6nm CO2 galvo system unlike any other system on the market. The CO2Cab is both a marking and cutting solution for many organ...

마킹 영역(X):9.06 in
마킹 영역(Y):9.06 in
1 사진