ENGIS EHG180
- スペック大きさ53.5” (W) x 31.5” (D) x 60” (H)重さ1763 (LBS)
- 製品概要
The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed to economically surface grind, as well as back-side grind, LED wafers to the highest level of flatness and surface finish, saving time and labor costs.
- 会社について
Engis provides full system solutions for flat lapping and precision bore finishing applications. We supply not only the capital equipment and machine accessories but a full range of tools and consumables. In addition to our Single Pass Bore Finishing Process, we now also offer multi-stroke honing systems. Our process develop labs can assist you with your flat lapping and precision honing requirements at no charge.
販売業者と販売会社
- 販売業者8Sap Technical & Marketing Consultants
No. 33/33/5, " Annapoorna", Kanakapura Road, Jaraganahalli
J.P.Nagar Post,
Bangalore, Karnataka 560 078
インド - 販売会社6