KOYO DXSG320
- SpecificheControlloCNCDimensioni1720W x 2180D (mm)Peso4900 (KGS)
- Descrizione del prodotto
Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers.
- Circa la società
Koyo produces various grinding machines, assemblies, spindles, precision ball screws, handle and universal joints, and drive shafts for industry. Additionally, Koyo performs applied engineering research and production engineering research.
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