KOYO DXSG320

  • Specs
    Control
    CNC
    Dimensions
    1720W x 2180D (mm)
    Weight
    4900 (KGS)
  • Product Overview

    Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers.

  • About Company
    Koyo Machine Industries Co., Ltd.

    Koyo produces various grinding machines, assemblies, spindles, precision ball screws, handle and universal joints, and drive shafts for industry. Additionally, Koyo performs applied engineering research and production engineering research.


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