KOYO DXSG320
- SpecsControlCNCDimensions1720W x 2180D (mm)Weight4900 (KGS)
- Product Overview
Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers.
- About Company
Koyo produces various grinding machines, assemblies, spindles, precision ball screws, handle and universal joints, and drive shafts for industry. Additionally, Koyo performs applied engineering research and production engineering research.
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